HEAT SINK ASSEMBLIES HAVING REMOVABLE PORTIONS

HEAT SINK ASSEMBLIES HAVING REMOVABLE PORTIONS

An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Allen, Joseph, Ganta Papa Rao Bala, Sunil Rao, Smith, Kelly K
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Beschreibung
Zusammenfassung:An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.