CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more secon...

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Bibliographische Detailangaben
Hauptverfasser: MENK, Gregory E, FUNG, Jason G, PERRY, Russell Edward, KRISHNAN, Kasiraman, PATIBANDLA, Nag B, ORILALL, Mahendra C, REDEKER, Fred C, DAVENPORT, Robert E, REDFIELD, Daniel, BAJAJ, Rajeev
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.