METHOD FOR PROVIDING A HERMETICALLY SEALED FEEDTHROUGH WITH CO-FIRED FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The g...

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Bibliographische Detailangaben
Hauptverfasser:	Tang, Xiaohong, Marzano, Thomas, Frustaci, Dominick J, Frysz, Christine A, Woods, Jason, Seitz, Keith W, Stevenson, Robert A, Brendel, Richard L, Thiebolt, William C, Winn, Steven W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASTING CURRENT COLLECTORS ELECTRICITY ELECTROTHERAPY HUMAN NECESSITIES HYGIENE LINE CONNECTORS MAGNETOTHERAPY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MEDICAL OR VETERINARY SCIENCE PERFORMING OPERATIONS POWDER METALLURGY RADIATION THERAPY TRANSPORTING ULTRASOUND THERAPY WORKING METALLIC POWDER
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