RESIN COMPOSITION FOR HIGH DIELECTRIC CONSTANT MATERIALS, MOLDED ARTICLE CONTAINING SAME, AND MASTER BATCH FOR COLORING

This resin composition for high dielectric constant materials contains 40-80% by mass of (A) a resin material and 20-60% by mass of (B) a carbon black. The carbon black (B) has a DBP absorption of 10-50 mL/100 g and an iodine adsorption of 5-40 mg/g. This resin composition for high dielectric consta...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIBAYASHI, Yutaka, SHIMOMAI, Ken, SUGIYAMA, Masahide, TSURUYA, Hirotaka
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	This resin composition for high dielectric constant materials contains 40-80% by mass of (A) a resin material and 20-60% by mass of (B) a carbon black. The carbon black (B) has a DBP absorption of 10-50 mL/100 g and an iodine adsorption of 5-40 mg/g. This resin composition for high dielectric constant materials has a dielectric constant of 4 or more and a dielectric loss tangent of 0.05 or less.