METHODS OF POSITIONING COMPONENT IN DESIRED POSITION ON A BOARD, PICK AND PLACE MACHINES, AND SENSORS FOR SUCH PICK AND PLACE MACHINES

A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired positi...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Horijon, Joseph L
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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