LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES

Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defin...

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Hauptverfasser:	Shafer, Steve, Roe, David, Tufty, Lyle Rick, Archer, Sean Michael
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS WEAPONS
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creator	Shafer, Steve Roe, David Tufty, Lyle Rick Archer, Sean Michael
description	Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
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subjects	BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS WEAPONS
title	LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES
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