SEMICONDUCTOR DEVICE

A semiconductor device includes a printed board, an electronic component, and a thermal diffuser. The electronic component and the thermal diffuser are bonded onto one main surface of the printed board. The electronic component and the thermal diffuser are electrically and thermally bonded to each o...

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Hauptverfasser:	KUMAGAI, Takashi, WAKAIKI, Shuji, FUJII, Kenta, SATO, Shota
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	KUMAGAI, Takashi WAKAIKI, Shuji FUJII, Kenta SATO, Shota
description	A semiconductor device includes a printed board, an electronic component, and a thermal diffuser. The electronic component and the thermal diffuser are bonded onto one main surface of the printed board. The electronic component and the thermal diffuser are electrically and thermally bonded to each other by a bonding material. The printed board includes an insulating layer and a plurality of radiation vias penetrating from the main surface to the other main surface of the printed board. At least a part of the plurality of radiation vias overlaps the electronic component, and at least another part of the plurality of radiation vias overlaps the thermal diffuser. At least a part of the plurality of radiation vias is disposed so as to overlap a heat radiator at a transmission viewpoint from the main surface of the printed board.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR DEVICE
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