TEMPORARY BONDING METHOD WITH THERMOPLASTIC ADHESIVE INCORPORATING A RIGID RING

A method for the temporary bonding of a substrate of interest to a handle substrate, comprising a step of forming an assembly by placing the bonding faces of the substrate of interest and of the handle substrate into contact with one another via a thermoplastic polymer, and a step of treating the as...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Montmeat, Pierre, Fournel, Frank, Zussy, Marc
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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