Substrate Processing Apparatus, Substrate Processing Method, and Recording Medium

A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution f...

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Hauptverfasser: KURE, Seiichi, NAITOU, Ryouichirou, SHITE, Hideo
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creator KURE, Seiichi
NAITOU, Ryouichirou
SHITE, Hideo
description A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020090967A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020090967A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020090967A13</originalsourceid><addsrcrecordid>eNrjZAgMLk0qLilKLElVCCjKT04tLs7MS1dwLChIBIqVFusoYJX3TS3JyE_RUUjMS1EISk3OL0qBiKZklubyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAyMDA0sDSzNzR0Nj4lQBALdDOIE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate Processing Apparatus, Substrate Processing Method, and Recording Medium</title><source>esp@cenet</source><creator>KURE, Seiichi ; NAITOU, Ryouichirou ; SHITE, Hideo</creator><creatorcontrib>KURE, Seiichi ; NAITOU, Ryouichirou ; SHITE, Hideo</creatorcontrib><description>A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200319&amp;DB=EPODOC&amp;CC=US&amp;NR=2020090967A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200319&amp;DB=EPODOC&amp;CC=US&amp;NR=2020090967A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KURE, Seiichi</creatorcontrib><creatorcontrib>NAITOU, Ryouichirou</creatorcontrib><creatorcontrib>SHITE, Hideo</creatorcontrib><title>Substrate Processing Apparatus, Substrate Processing Method, and Recording Medium</title><description>A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgMLk0qLilKLElVCCjKT04tLs7MS1dwLChIBIqVFusoYJX3TS3JyE_RUUjMS1EISk3OL0qBiKZklubyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAyMDA0sDSzNzR0Nj4lQBALdDOIE</recordid><startdate>20200319</startdate><enddate>20200319</enddate><creator>KURE, Seiichi</creator><creator>NAITOU, Ryouichirou</creator><creator>SHITE, Hideo</creator><scope>EVB</scope></search><sort><creationdate>20200319</creationdate><title>Substrate Processing Apparatus, Substrate Processing Method, and Recording Medium</title><author>KURE, Seiichi ; NAITOU, Ryouichirou ; SHITE, Hideo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020090967A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KURE, Seiichi</creatorcontrib><creatorcontrib>NAITOU, Ryouichirou</creatorcontrib><creatorcontrib>SHITE, Hideo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KURE, Seiichi</au><au>NAITOU, Ryouichirou</au><au>SHITE, Hideo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate Processing Apparatus, Substrate Processing Method, and Recording Medium</title><date>2020-03-19</date><risdate>2020</risdate><abstract>A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Substrate Processing Apparatus, Substrate Processing Method, and Recording Medium
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T00%3A35%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KURE,%20Seiichi&rft.date=2020-03-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2020090967A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true