MULTILAYER CERAMIC CAPACITOR, PACKAGE OF MULTILAYER CERAMIC CAPACITOR AND COMPONENT MOUNTING CIRCUIT SUBSTRATE
A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face...
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| creator | OZAWA, Manabu MAEKAWA, Kazuya NOSAKI, Takeshi ARIGA, Jyouji MOTEKI, Hiroyuki ARAI, Norihiro |
| description | A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side. |
| format | Patent |
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a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEsDqK-w4GrQoxLHM8zrcEmKcllcCpF4iS1UN8fHZzF6f-Hby4Glxu2DV5NBDIRnSUgbJEsh7iBz1ywNhAq-AUB_QkouDZ44xlcyJ6tr4FspGwZUj4mjshmKWb3_jGV1bcLsa4M03lbxmdXprG_laG8upyUVFJqddAad_v_1BtRwDhv</recordid><startdate>20200312</startdate><enddate>20200312</enddate><creator>OZAWA, Manabu</creator><creator>MAEKAWA, Kazuya</creator><creator>NOSAKI, Takeshi</creator><creator>ARIGA, Jyouji</creator><creator>MOTEKI, Hiroyuki</creator><creator>ARAI, Norihiro</creator><scope>EVB</scope></search><sort><creationdate>20200312</creationdate><title>MULTILAYER CERAMIC CAPACITOR, PACKAGE OF MULTILAYER CERAMIC CAPACITOR AND COMPONENT MOUNTING CIRCUIT SUBSTRATE</title><author>OZAWA, Manabu ; MAEKAWA, Kazuya ; NOSAKI, Takeshi ; ARIGA, Jyouji ; MOTEKI, Hiroyuki ; ARAI, Norihiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020082988A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>OZAWA, Manabu</creatorcontrib><creatorcontrib>MAEKAWA, Kazuya</creatorcontrib><creatorcontrib>NOSAKI, Takeshi</creatorcontrib><creatorcontrib>ARIGA, Jyouji</creatorcontrib><creatorcontrib>MOTEKI, Hiroyuki</creatorcontrib><creatorcontrib>ARAI, Norihiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OZAWA, Manabu</au><au>MAEKAWA, Kazuya</au><au>NOSAKI, Takeshi</au><au>ARIGA, Jyouji</au><au>MOTEKI, Hiroyuki</au><au>ARAI, Norihiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER CERAMIC CAPACITOR, PACKAGE OF MULTILAYER CERAMIC CAPACITOR AND COMPONENT MOUNTING CIRCUIT SUBSTRATE</title><date>2020-03-12</date><risdate>2020</risdate><abstract>A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | MULTILAYER CERAMIC CAPACITOR, PACKAGE OF MULTILAYER CERAMIC CAPACITOR AND COMPONENT MOUNTING CIRCUIT SUBSTRATE |
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