LDMOS DEVICE WITH A FIELD PLATE CONTACT METAL LAYER WITH A SUB-MAXIMUM SIZE

An LDMOS device with a field plate contact having a field plate contact metal layer being positioned above the field plate contact. The field plate contact metal layer has a sub-maximum size satisfied for the electrical connection between the field plate contact and an external applying voltage. Thi...

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Bibliographische Detailangaben

Hauptverfasser:	Braun, Eric, Jung, Jeesung, McGregor, Joel
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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