Methods of Alignment Marking Semiconductor Wafers, and Semiconductor Packages having Portions of Alignment Markings

Some embodiments include a semiconductor package. The semiconductor package has a semiconductor die with a primary region which includes integrated circuitry, and with an edge region which includes a portion of an alignment mark location. The portion of the alignment mark location includes a segment...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Housley, Richard T, Zhou, Jianming
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!