METHODS FOR PURGING A SUBSTRATE CARRIER AT A FACTORY INTERFACE

METHODS FOR PURGING A SUBSTRATE CARRIER AT A FACTORY INTERFACE

A method of purging a substrate carrier at a load port includes: opening a door of a substrate carrier that is delivered to a load port; spraying the substrate carrier with a gas flow responsive to the opening the door; mapping substrates within the substrate carrier to generate a substrate map; det...

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Bibliographische Detailangaben
Hauptverfasser: Rao, Vivek R, Kumar, Naveen, Carpenter, Kenneth, Srichurnam, Dharma Ratnam, Pannese, Patrick, Iyer, Subramaniam V, MacLeod, Douglas, Holeyannavar, Devendrappa
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A method of purging a substrate carrier at a load port includes: opening a door of a substrate carrier that is delivered to a load port; spraying the substrate carrier with a gas flow responsive to the opening the door; mapping substrates within the substrate carrier to generate a substrate map; determining a process purge state based on the substrate map; and activating one or more inter-substrate nozzle arrays and one or more curtain nozzle arrays using a predefined spray status configuration for the process purge state.