PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDIUM CONTAINING A PROGRAM FOR CAUSING A COMPUTER TO EXECUTE THE PLATING SYSTEM CONTROL METHOD

A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the...

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Bibliographische Detailangaben

Hauptverfasser:	Yokoyama, Toshio, Oishi, Kunio, Koizumi, Ryuya, Mitsuya, Takashi, Shimoyama, Masashi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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