WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

A wiring substrate includes first wiring portions, an insulation layer covering the first wiring portions, openings extending through the insulation layer in a thickness-wise direction, partially exposing upper surfaces of the first wiring portions, and differing from each other in capacity, and sec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAI, Takashi, FUKASE, Katsuya, KATAGIRI, Fumimasa
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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