CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLATED SIGNAL LEADS

In a general aspect, a chip-on-lead semiconductor device package can include a leadframe having a plurality of signal leads. The plurality of signal leads can include at least two signal leads each having a first face with a first surface area and, opposite the first face, a second face with a secon...

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Bibliographische Detailangaben

Hauptverfasser:	LIEW, How Kiat, WANG, Soon Wei, LIONG, Jin Yoong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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