Integrated Circuit Package Including Miniature Antenna

The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANGUERA PROS, Jaume, SOLER CASTANY, Jordi, PUENTE BALIARDA, Carles, BORJA BORAU, Carmen
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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