PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION
A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direct...
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| creator | TAKANO, Shoji NARISAWA, Yoshihiko MATSUDA, Fumihiko |
| description | A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90. |
| format | Patent |
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A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE ; WAVEGUIDES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200109&DB=EPODOC&CC=US&NR=2020015351A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200109&DB=EPODOC&CC=US&NR=2020015351A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKANO, Shoji</creatorcontrib><creatorcontrib>NARISAWA, Yoshihiko</creatorcontrib><creatorcontrib>MATSUDA, Fumihiko</creatorcontrib><title>PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION</title><description>A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</subject><subject>WAVEGUIDES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJCPL0C3F1UQj3BDLcFZz8HYNcFNz8gxQ8PN09FNyCXANDXf2cIxVCghz9gn09g4M9_f14GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgZGBgaGpsamho6ExcaoAcq8oZg</recordid><startdate>20200109</startdate><enddate>20200109</enddate><creator>TAKANO, Shoji</creator><creator>NARISAWA, Yoshihiko</creator><creator>MATSUDA, Fumihiko</creator><scope>EVB</scope></search><sort><creationdate>20200109</creationdate><title>PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION</title><author>TAKANO, Shoji ; NARISAWA, Yoshihiko ; MATSUDA, Fumihiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020015351A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE</topic><topic>WAVEGUIDES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKANO, Shoji</creatorcontrib><creatorcontrib>NARISAWA, Yoshihiko</creatorcontrib><creatorcontrib>MATSUDA, Fumihiko</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKANO, Shoji</au><au>NARISAWA, Yoshihiko</au><au>MATSUDA, Fumihiko</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION</title><date>2020-01-09</date><risdate>2020</risdate><abstract>A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES |
| title | PRINTED WIRING BOARD FOR HIGH FREQUENCY TRANSMISSION |
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