CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURING METHOD AND ELECTRONIC DEVICE

The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive e...

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Bibliographische Detailangaben
Hauptverfasser: WANG, Mingzhu, CHEN, Liefeng, ZHAO, Bojie, TANAKA, Takehiko, HUANG, Zhen, LUAN, Zhongyu, CHENG, Duanliang
Format: Patent
Sprache:eng
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