DEVICE CONTAINING AND METHOD OF PROVIDING CARBON COVERED COPPER LAYER

A device and method of preventing corrosion of a copper layer in a PCB is disclosed. A first dielectric is disposed on a substrate. A copper layer is plated in an opening in the first dielectric and, after conditioning the copper layer, a redistribution layer is plated on the copper layer. A solder resist layer is disposed above the copper layer. A solder ball is disposed in an opening in the solder resist layer. The solder ball is in conductive contact with the copper layer and in physical contact with the redistribution layer. A non-conductive carbon layer is disposed on and in contact with the redistribution layer or tsi-diehe solder resist layer. The carbon layer is substantially thinner than the copper layer and acts as a diffusion barrier to moisture for the copper layer.