HEAT CONDUCTION STRUCTURE OR SEMICONDUCTOR APPARATUS

The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DEGUCHI, Masataka, HASHIMI, Kazuo, BESSHO, Takeshi, SAITO, Nagahiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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