LOW COST WAFER BONDING METHOD

The invention is directed to an inexpensive method for bonding two wafers. The method uses an adhesive material disposed between two handling sheets and stamped with a plurality of through holes. The through holes are registered with the locations of devices formed on a substrate. The adhesive mater...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SUMMERS, Jeffery F
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention is directed to an inexpensive method for bonding two wafers. The method uses an adhesive material disposed between two handling sheets and stamped with a plurality of through holes. The through holes are registered with the locations of devices formed on a substrate. The adhesive material is placed between to two substrates, around the devices, and cured.