FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY

The disclosure describes techniques for eliminating or reducing non-wet open (NWO) defect formation by using a low activity flux to prevent a solder paste from sticking to ball grid array (BGA) solder balls during reflow soldering. The low activity flux may be configured such that: i) it creates a b...

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Bibliographische Detailangaben
Hauptverfasser: ZHOU, FENGYING, CHEN, FEN, LEE, NINGNG
Format: Patent
Sprache:eng
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