Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making

A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24)...

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Hauptverfasser: GOTTWALD, Thomas, Rössle, Christian
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creator GOTTWALD, Thomas
Rössle, Christian
description A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019363043A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019363043A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019363043A13</originalsourceid><addsrcrecordid>eNqVzMEKwjAQBNBePIj6DwueC60RoUcRxaOgnsuabNvFNAmblH6LfysFvetpGOYx8-x18SMJkCWdxDvW0FNCm2sS7KfmzWAJ0BkIwi6RAc2iB07w8CjmC0ZOHUx7Kzih8Met1xQjNF4gdcQCPT7Ztcts1qCNtPrkIlufjrfDOafga4oBNTlK9f26KcpK7VSxVftS_abeaARUKQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making</title><source>esp@cenet</source><creator>GOTTWALD, Thomas ; Rössle, Christian</creator><creatorcontrib>GOTTWALD, Thomas ; Rössle, Christian</creatorcontrib><description>A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191128&amp;DB=EPODOC&amp;CC=US&amp;NR=2019363043A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191128&amp;DB=EPODOC&amp;CC=US&amp;NR=2019363043A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOTTWALD, Thomas</creatorcontrib><creatorcontrib>Rössle, Christian</creatorcontrib><title>Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making</title><description>A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqVzMEKwjAQBNBePIj6DwueC60RoUcRxaOgnsuabNvFNAmblH6LfysFvetpGOYx8-x18SMJkCWdxDvW0FNCm2sS7KfmzWAJ0BkIwi6RAc2iB07w8CjmC0ZOHUx7Kzih8Met1xQjNF4gdcQCPT7Ztcts1qCNtPrkIlufjrfDOafga4oBNTlK9f26KcpK7VSxVftS_abeaARUKQ</recordid><startdate>20191128</startdate><enddate>20191128</enddate><creator>GOTTWALD, Thomas</creator><creator>Rössle, Christian</creator><scope>EVB</scope></search><sort><creationdate>20191128</creationdate><title>Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making</title><author>GOTTWALD, Thomas ; Rössle, Christian</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019363043A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GOTTWALD, Thomas</creatorcontrib><creatorcontrib>Rössle, Christian</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOTTWALD, Thomas</au><au>Rössle, Christian</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making</title><date>2019-11-28</date><risdate>2019</risdate><abstract>A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T02%3A13%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GOTTWALD,%20Thomas&rft.date=2019-11-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019363043A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true