SIDE MOUNTED INTERCONNECT BRIDGES

SIDE MOUNTED INTERCONNECT BRIDGES

A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. I...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Doran, Kevin J, Zhang, Yu Amos, Qian, Zhiguo, Hossain, MD Altaf
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Doran, Kevin J
Zhang, Yu Amos
Qian, Zhiguo
Hossain, MD Altaf
description A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019341349A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019341349A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019341349A13</originalsourceid><addsrcrecordid>eNrjZFAM9nRxVfD1D_ULcXVR8ASSQc7-fn6uziEKTkGeLu6uwTwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JD402MjA0NLYxNDYxNLR0Jg4VQCmGyMx</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SIDE MOUNTED INTERCONNECT BRIDGES</title><source>esp@cenet</source><creator>Doran, Kevin J ; Zhang, Yu Amos ; Qian, Zhiguo ; Hossain, MD Altaf</creator><creatorcontrib>Doran, Kevin J ; Zhang, Yu Amos ; Qian, Zhiguo ; Hossain, MD Altaf</creatorcontrib><description>A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191107&amp;DB=EPODOC&amp;CC=US&amp;NR=2019341349A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191107&amp;DB=EPODOC&amp;CC=US&amp;NR=2019341349A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Doran, Kevin J</creatorcontrib><creatorcontrib>Zhang, Yu Amos</creatorcontrib><creatorcontrib>Qian, Zhiguo</creatorcontrib><creatorcontrib>Hossain, MD Altaf</creatorcontrib><title>SIDE MOUNTED INTERCONNECT BRIDGES</title><description>A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAM9nRxVfD1D_ULcXVR8ASSQc7-fn6uziEKTkGeLu6uwTwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JD402MjA0NLYxNDYxNLR0Jg4VQCmGyMx</recordid><startdate>20191107</startdate><enddate>20191107</enddate><creator>Doran, Kevin J</creator><creator>Zhang, Yu Amos</creator><creator>Qian, Zhiguo</creator><creator>Hossain, MD Altaf</creator><scope>EVB</scope></search><sort><creationdate>20191107</creationdate><title>SIDE MOUNTED INTERCONNECT BRIDGES</title><author>Doran, Kevin J ; Zhang, Yu Amos ; Qian, Zhiguo ; Hossain, MD Altaf</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019341349A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Doran, Kevin J</creatorcontrib><creatorcontrib>Zhang, Yu Amos</creatorcontrib><creatorcontrib>Qian, Zhiguo</creatorcontrib><creatorcontrib>Hossain, MD Altaf</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Doran, Kevin J</au><au>Zhang, Yu Amos</au><au>Qian, Zhiguo</au><au>Hossain, MD Altaf</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SIDE MOUNTED INTERCONNECT BRIDGES</title><date>2019-11-07</date><risdate>2019</risdate><abstract>A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2019341349A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SIDE MOUNTED INTERCONNECT BRIDGES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T14%3A53%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Doran,%20Kevin%20J&rft.date=2019-11-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019341349A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true