ENGINEERING THERMOPLASTIC COMPOSITIONS WITH HIGH NANO MOLDING BONDING STRENGTH AND LASER DIRECT STRUCTURING FUNCTION
A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the...
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creator | WEI, Zhenke WU, Tong WANG, Qin CHENG, Yunan |
description | A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the polymeric base resin includes polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), poly(p-phenylene oxide) (PPO), or combinations thereof. In certain aspects the thermoplastic composition has a nano molding technology (NMT) bonding strength of at least about 20 MPa when bonded to aluminum alloy. In further aspects the thermoplastic composition includes a plating index of at least a about 0.25. The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices. |
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The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191024&DB=EPODOC&CC=US&NR=2019322861A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191024&DB=EPODOC&CC=US&NR=2019322861A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEI, Zhenke</creatorcontrib><creatorcontrib>WU, Tong</creatorcontrib><creatorcontrib>WANG, Qin</creatorcontrib><creatorcontrib>CHENG, Yunan</creatorcontrib><title>ENGINEERING THERMOPLASTIC COMPOSITIONS WITH HIGH NANO MOLDING BONDING STRENGTH AND LASER DIRECT STRUCTURING FUNCTION</title><description>A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. 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The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjMEKgkAURd20iOofHrQOUiFqOY2j8yDfk5k3tBSJaRUl6P-TSh_Q6izuPWedjIYqJGMcUgVijau5uSkvqEFz3bBHQSYPdxQLFisLpIih5lsxG1emhV7cFJouigqYfOOgQGe0zEvQEpZ-GUjPuW2yenavIe5-3CT70oi2h9h_2jj03SO-49gGnx3TS55l51Oq0vy_1xf6OTp7</recordid><startdate>20191024</startdate><enddate>20191024</enddate><creator>WEI, Zhenke</creator><creator>WU, Tong</creator><creator>WANG, Qin</creator><creator>CHENG, Yunan</creator><scope>EVB</scope></search><sort><creationdate>20191024</creationdate><title>ENGINEERING THERMOPLASTIC COMPOSITIONS WITH HIGH NANO MOLDING BONDING STRENGTH AND LASER DIRECT STRUCTURING FUNCTION</title><author>WEI, Zhenke ; WU, Tong ; WANG, Qin ; CHENG, Yunan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019322861A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>WEI, Zhenke</creatorcontrib><creatorcontrib>WU, Tong</creatorcontrib><creatorcontrib>WANG, Qin</creatorcontrib><creatorcontrib>CHENG, Yunan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEI, Zhenke</au><au>WU, Tong</au><au>WANG, Qin</au><au>CHENG, Yunan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ENGINEERING THERMOPLASTIC COMPOSITIONS WITH HIGH NANO MOLDING BONDING STRENGTH AND LASER DIRECT STRUCTURING FUNCTION</title><date>2019-10-24</date><risdate>2019</risdate><abstract>A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the polymeric base resin includes polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), poly(p-phenylene oxide) (PPO), or combinations thereof. In certain aspects the thermoplastic composition has a nano molding technology (NMT) bonding strength of at least about 20 MPa when bonded to aluminum alloy. In further aspects the thermoplastic composition includes a plating index of at least a about 0.25. The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | ENGINEERING THERMOPLASTIC COMPOSITIONS WITH HIGH NANO MOLDING BONDING STRENGTH AND LASER DIRECT STRUCTURING FUNCTION |
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