3-DIMENSIONAL PRINTING PROCESS FOR INTEGRATED MAGNETICS

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectri...

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Bibliographische Detailangaben
Hauptverfasser: DISNEY, Donald Ray, NAIR, Rajesh Sankaranarayanan, PENG, Lulu, SUSAI, Lawrence Selvaraj
Format: Patent
Sprache:eng
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