SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME

SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME

A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yamashita, Tomoyuki, Tabuchi, Kiyotaka, Toumiya, Yoshinori, Ogino, Akiko, Ootsuka, Yoichi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Yamashita, Tomoyuki
Tabuchi, Kiyotaka
Toumiya, Yoshinori
Ogino, Akiko
Ootsuka, Yoichi
description A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019312074A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019312074A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019312074A13</originalsourceid><addsrcrecordid>eNqNi0sKwjAUALNxIeodHrguNK0gLh_JSxNoEsin4qoUiSvRQr0_KngAV8PAzJrl6Hsjq5gwERiLnXEdSBqMIDibpKHHCwWSYI0IvicXKQK6j1PSXoLyASy6rFCkHL5zREtbtrpN96XsftywvaIkdFXm51iWebqWR3mNOTY1P7W8qY8H5O1_1RsSpTE6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME</title><source>esp@cenet</source><creator>Yamashita, Tomoyuki ; Tabuchi, Kiyotaka ; Toumiya, Yoshinori ; Ogino, Akiko ; Ootsuka, Yoichi</creator><creatorcontrib>Yamashita, Tomoyuki ; Tabuchi, Kiyotaka ; Toumiya, Yoshinori ; Ogino, Akiko ; Ootsuka, Yoichi</creatorcontrib><description>A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191010&amp;DB=EPODOC&amp;CC=US&amp;NR=2019312074A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191010&amp;DB=EPODOC&amp;CC=US&amp;NR=2019312074A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yamashita, Tomoyuki</creatorcontrib><creatorcontrib>Tabuchi, Kiyotaka</creatorcontrib><creatorcontrib>Toumiya, Yoshinori</creatorcontrib><creatorcontrib>Ogino, Akiko</creatorcontrib><creatorcontrib>Ootsuka, Yoichi</creatorcontrib><title>SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME</title><description>A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0sKwjAUALNxIeodHrguNK0gLh_JSxNoEsin4qoUiSvRQr0_KngAV8PAzJrl6Hsjq5gwERiLnXEdSBqMIDibpKHHCwWSYI0IvicXKQK6j1PSXoLyASy6rFCkHL5zREtbtrpN96XsftywvaIkdFXm51iWebqWR3mNOTY1P7W8qY8H5O1_1RsSpTE6</recordid><startdate>20191010</startdate><enddate>20191010</enddate><creator>Yamashita, Tomoyuki</creator><creator>Tabuchi, Kiyotaka</creator><creator>Toumiya, Yoshinori</creator><creator>Ogino, Akiko</creator><creator>Ootsuka, Yoichi</creator><scope>EVB</scope></search><sort><creationdate>20191010</creationdate><title>SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME</title><author>Yamashita, Tomoyuki ; Tabuchi, Kiyotaka ; Toumiya, Yoshinori ; Ogino, Akiko ; Ootsuka, Yoichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019312074A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Yamashita, Tomoyuki</creatorcontrib><creatorcontrib>Tabuchi, Kiyotaka</creatorcontrib><creatorcontrib>Toumiya, Yoshinori</creatorcontrib><creatorcontrib>Ogino, Akiko</creatorcontrib><creatorcontrib>Ootsuka, Yoichi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yamashita, Tomoyuki</au><au>Tabuchi, Kiyotaka</au><au>Toumiya, Yoshinori</au><au>Ogino, Akiko</au><au>Ootsuka, Yoichi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME</title><date>2019-10-10</date><risdate>2019</risdate><abstract>A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2019312074A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
title SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T18%3A06%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Yamashita,%20Tomoyuki&rft.date=2019-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019312074A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true