FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The meta...

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Bibliographische Detailangaben

Hauptverfasser:	KEUSSEYAN, Roupen Leon, MOBLEY, Tim
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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