SEMICONDUCTOR MODULE
A semiconductor module 1 according to one embodiment includes a first circuit board, circuit units and a first plate member; the circuit units include a second plate member, a vertical type transistor and a second circuit board; n first circuit unit of N circuit units electrically connect a back sur...
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| creator | OOMORI, Hirotaka |
| description | A semiconductor module 1 according to one embodiment includes a first circuit board, circuit units and a first plate member; the circuit units include a second plate member, a vertical type transistor and a second circuit board; n first circuit unit of N circuit units electrically connect a back surface side conductive region to the first input interconnection pattern of the first circuit board; (N−n) second circuit unit of the N circuit units electrically connect the third conductive pattern and the fourth conductive pattern of the second circuit board to the first control interconnection pattern and the second input interconnection pattern of the first circuit board; the first plate member electrically connects the fourth conductive pattern of the first circuit units to the second plate member of the second circuit units; and the gate electrode pad of the vertical type transistor contained in the first circuit unit is electrically connected to the first control interconnection pattern of the first circuit board. |
| format | Patent |
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(N−n) second circuit unit of the N circuit units electrically connect the third conductive pattern and the fourth conductive pattern of the second circuit board to the first control interconnection pattern and the second input interconnection pattern of the first circuit board; the first plate member electrically connects the fourth conductive pattern of the first circuit units to the second plate member of the second circuit units; and the gate electrode pad of the vertical type transistor contained in the first circuit unit is electrically connected to the first control interconnection pattern of the first circuit board.</description><language>eng</language><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS ; BASIC ELECTRIC ELEMENTS ; CONTROL OR REGULATION THEREOF ; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; 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the circuit units include a second plate member, a vertical type transistor and a second circuit board; n first circuit unit of N circuit units electrically connect a back surface side conductive region to the first input interconnection pattern of the first circuit board; (N−n) second circuit unit of the N circuit units electrically connect the third conductive pattern and the fourth conductive pattern of the second circuit board to the first control interconnection pattern and the second input interconnection pattern of the first circuit board; the first plate member electrically connects the fourth conductive pattern of the first circuit units to the second plate member of the second circuit units; and the gate electrode pad of the vertical type transistor contained in the first circuit unit is electrically connected to the first control interconnection pattern of the first circuit board.</description><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONTROL OR REGULATION THEREOF</subject><subject>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUvD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhpZGFuaWJhaOhsbEqQIACOMf2A</recordid><startdate>20190919</startdate><enddate>20190919</enddate><creator>OOMORI, Hirotaka</creator><scope>EVB</scope></search><sort><creationdate>20190919</creationdate><title>SEMICONDUCTOR MODULE</title><author>OOMORI, Hirotaka</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019287948A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONTROL OR REGULATION THEREOF</topic><topic>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OOMORI, Hirotaka</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OOMORI, Hirotaka</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE</title><date>2019-09-19</date><risdate>2019</risdate><abstract>A semiconductor module 1 according to one embodiment includes a first circuit board, circuit units and a first plate member; the circuit units include a second plate member, a vertical type transistor and a second circuit board; n first circuit unit of N circuit units electrically connect a back surface side conductive region to the first input interconnection pattern of the first circuit board; (N−n) second circuit unit of the N circuit units electrically connect the third conductive pattern and the fourth conductive pattern of the second circuit board to the first control interconnection pattern and the second input interconnection pattern of the first circuit board; the first plate member electrically connects the fourth conductive pattern of the first circuit units to the second plate member of the second circuit units; and the gate electrode pad of the vertical type transistor contained in the first circuit unit is electrically connected to the first control interconnection pattern of the first circuit board.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR MODULE |
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