THIN FILM FORMING APPARATUS AND TRANSPARENT CONDUCTIVE FILM
A thin film forming apparatus including: a first chamber configured to generate a mist of a dispersion liquid, and including an outlet; a second chamber configured to receive the generated mist from the first chamber and collect particles of the generated mist having a size greater than a predetermi...
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| creator | NAKAZUMI, Makoto NISHI, Yasutaka |
| description | A thin film forming apparatus including: a first chamber configured to generate a mist of a dispersion liquid, and including an outlet; a second chamber configured to receive the generated mist from the first chamber and collect particles of the generated mist having a size greater than a predetermined value, and including an inlet provided on a top of the second chamber and connected to the outlet of the first chamber, and an outlet provided on the top of the second chamber and configured to transfer, as homogenized mist, particles of the generated mist having a size less than or equal to the predetermined value due to the effect of gravity on the particles of the mist; and a third chamber configured to receive the homogenized mist from the second chamber, and including an inlet connected to the outlet of the second chamber. |
| format | Patent |
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and a third chamber configured to receive the homogenized mist from the second chamber, and including an inlet connected to the outlet of the second chamber.</description><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CALCULATING ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COMPUTING ; COUNTING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DIGITAL DATA PROCESSING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PERFORMING OPERATIONS ; PHYSICS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; 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a second chamber configured to receive the generated mist from the first chamber and collect particles of the generated mist having a size greater than a predetermined value, and including an inlet provided on a top of the second chamber and connected to the outlet of the first chamber, and an outlet provided on the top of the second chamber and configured to transfer, as homogenized mist, particles of the generated mist having a size less than or equal to the predetermined value due to the effect of gravity on the particles of the mist; and a third chamber configured to receive the homogenized mist from the second chamber, and including an inlet connected to the outlet of the second chamber.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CALCULATING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAO8fD0U3Dz9PFVcPMP8vX0c1dwDAhwDHIMCQ1WcPRzUQgJcvQLBgq4-oUoOPv7uYQ6h3iGuYJ18DCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwNDSyMzIwtTC0dDY-JUAQCObCpr</recordid><startdate>20190829</startdate><enddate>20190829</enddate><creator>NAKAZUMI, Makoto</creator><creator>NISHI, Yasutaka</creator><scope>EVB</scope></search><sort><creationdate>20190829</creationdate><title>THIN FILM FORMING APPARATUS AND TRANSPARENT CONDUCTIVE FILM</title><author>NAKAZUMI, Makoto ; NISHI, Yasutaka</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019262858A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CALCULATING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAZUMI, Makoto</creatorcontrib><creatorcontrib>NISHI, Yasutaka</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAZUMI, Makoto</au><au>NISHI, Yasutaka</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THIN FILM FORMING APPARATUS AND TRANSPARENT CONDUCTIVE FILM</title><date>2019-08-29</date><risdate>2019</risdate><abstract>A thin film forming apparatus including: a first chamber configured to generate a mist of a dispersion liquid, and including an outlet; a second chamber configured to receive the generated mist from the first chamber and collect particles of the generated mist having a size greater than a predetermined value, and including an inlet provided on a top of the second chamber and connected to the outlet of the first chamber, and an outlet provided on the top of the second chamber and configured to transfer, as homogenized mist, particles of the generated mist having a size less than or equal to the predetermined value due to the effect of gravity on the particles of the mist; and a third chamber configured to receive the homogenized mist from the second chamber, and including an inlet connected to the outlet of the second chamber.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CALCULATING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DIGITAL DATA PROCESSING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | THIN FILM FORMING APPARATUS AND TRANSPARENT CONDUCTIVE FILM |
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