EMITTER-ON-SUB-MOUNT DEVICE

A device may comprise a lead-frame comprising a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical device...

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Hauptverfasser: Guan, Yongfeng, Srinivasan, Raman, Khassine, Slava, Wong, Vincent V, Skidmore, Jay A, Lee, Kong Weng, Yalamanchili, Prasad, Samadi, Gity
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creator Guan, Yongfeng
Srinivasan, Raman
Khassine, Slava
Wong, Vincent V
Skidmore, Jay A
Lee, Kong Weng
Yalamanchili, Prasad
Samadi, Gity
description A device may comprise a lead-frame comprising a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019252849A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019252849A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019252849A13</originalsourceid><addsrcrecordid>eNrjZJB29fUMCXEN0vX30w0OddL19Q_1C1FwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoaWRqZGFiaWjobGxKkCANwrIZU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EMITTER-ON-SUB-MOUNT DEVICE</title><source>esp@cenet</source><creator>Guan, Yongfeng ; Srinivasan, Raman ; Khassine, Slava ; Wong, Vincent V ; Skidmore, Jay A ; Lee, Kong Weng ; Yalamanchili, Prasad ; Samadi, Gity</creator><creatorcontrib>Guan, Yongfeng ; Srinivasan, Raman ; Khassine, Slava ; Wong, Vincent V ; Skidmore, Jay A ; Lee, Kong Weng ; Yalamanchili, Prasad ; Samadi, Gity</creatorcontrib><description>A device may comprise a lead-frame comprising a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190815&amp;DB=EPODOC&amp;CC=US&amp;NR=2019252849A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190815&amp;DB=EPODOC&amp;CC=US&amp;NR=2019252849A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Guan, Yongfeng</creatorcontrib><creatorcontrib>Srinivasan, Raman</creatorcontrib><creatorcontrib>Khassine, Slava</creatorcontrib><creatorcontrib>Wong, Vincent V</creatorcontrib><creatorcontrib>Skidmore, Jay A</creatorcontrib><creatorcontrib>Lee, Kong Weng</creatorcontrib><creatorcontrib>Yalamanchili, Prasad</creatorcontrib><creatorcontrib>Samadi, Gity</creatorcontrib><title>EMITTER-ON-SUB-MOUNT DEVICE</title><description>A device may comprise a lead-frame comprising a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB29fUMCXEN0vX30w0OddL19Q_1C1FwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoaWRqZGFiaWjobGxKkCANwrIZU</recordid><startdate>20190815</startdate><enddate>20190815</enddate><creator>Guan, Yongfeng</creator><creator>Srinivasan, Raman</creator><creator>Khassine, Slava</creator><creator>Wong, Vincent V</creator><creator>Skidmore, Jay A</creator><creator>Lee, Kong Weng</creator><creator>Yalamanchili, Prasad</creator><creator>Samadi, Gity</creator><scope>EVB</scope></search><sort><creationdate>20190815</creationdate><title>EMITTER-ON-SUB-MOUNT DEVICE</title><author>Guan, Yongfeng ; Srinivasan, Raman ; Khassine, Slava ; Wong, Vincent V ; Skidmore, Jay A ; Lee, Kong Weng ; Yalamanchili, Prasad ; Samadi, Gity</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019252849A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Guan, Yongfeng</creatorcontrib><creatorcontrib>Srinivasan, Raman</creatorcontrib><creatorcontrib>Khassine, Slava</creatorcontrib><creatorcontrib>Wong, Vincent V</creatorcontrib><creatorcontrib>Skidmore, Jay A</creatorcontrib><creatorcontrib>Lee, Kong Weng</creatorcontrib><creatorcontrib>Yalamanchili, Prasad</creatorcontrib><creatorcontrib>Samadi, Gity</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Guan, Yongfeng</au><au>Srinivasan, Raman</au><au>Khassine, Slava</au><au>Wong, Vincent V</au><au>Skidmore, Jay A</au><au>Lee, Kong Weng</au><au>Yalamanchili, Prasad</au><au>Samadi, Gity</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMITTER-ON-SUB-MOUNT DEVICE</title><date>2019-08-15</date><risdate>2019</risdate><abstract>A device may comprise a lead-frame comprising a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title EMITTER-ON-SUB-MOUNT DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T03%3A32%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Guan,%20Yongfeng&rft.date=2019-08-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2019252849A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true