BACK-SIDE ILLUMINATED IMAGE SENSOR

Image sensors and methods of manufacturing image sensors are provided herein. In an embodiment, a method of manufacturing an image sensor includes forming a structure having a front side and a back side. The structure includes a semiconductor layer extending between the front side and the back side...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GAY, Laurent, FONTENEAU, Pascal, LALANNE, Frederic, HENRION, Yann, GUYADER, Francois
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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