COOLING ELEMENT FOR AN ELECTROSTATIC CHUCK ASSEMBLY

An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top s...

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Bibliographische Detailangaben
Hauptverfasser: Willwerth, Michael D, Cotlear, Roberto Cesar, Schmid, Andreas
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top surface, a first cooling channel, a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel, and a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck. The first thermal spreading element is formed from a second material that has a thermal conductivity higher than a thermal conductivity of the first material.