SEMICONDUCTOR PACKAGE INCLUDING A THERMAL CONDUCTIVE LAYER AND METHOD OF MANUFACTURING THE SAME

A semiconductor package includes a semiconductor chip having a first surface that is an active surface and a second surface opposing the first surface, a first redistribution portion disposed on the first surface, the first redistribution portion including a lower wiring layer electrically connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK, Woo Hyun, CHO, Young Sang, KIM, Jae Choon, JANG, Eon Soo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!