AUTOMATED APPARATUS TO TEMPORARILY ATTACH SUBSTRATES TO CARRIERS WITHOUT ADHESIVES FOR PROCESSING

Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUMAR, Niranjan, BREILING, Maureen, RAMASWAMI, Seshadri, ASSAF, Shay, CONSTANT, Andy, SADE, Amikam
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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