Semiconductor Device Including First and Second Contact Layers and Manufacturing Method

An embodiment relates to a method for manufacturing a semiconductor device. The method includes providing a semiconductor body including a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type interposed between the first semiconducto...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Pfirsch, Frank Dieter, Huesken, Holger
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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