RESIN COMPOSITION AND LAMINATE USING SAME

A resin composition is provided for an adhesive layer of a laminate, the resin composition, containing: (A) 55 to 85 mass % of an acid modified polypropylene-based resin; and (B) 45 to 15 mass % of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate...

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Bibliographische Detailangaben
Hauptverfasser:	ZENNYOJI, Yoshihiro, INOMATA, Sayuri
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A resin composition is provided for an adhesive layer of a laminate, the resin composition, containing: (A) 55 to 85 mass % of an acid modified polypropylene-based resin; and (B) 45 to 15 mass % of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, an alkyl methacrylate, and an alkyl acrylate; in which the total of the component (A) and the component (B) is 100 mass %; and in which an acid modified amount of the component (A) is 0.5 to 10 mol %.