ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY

An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead fra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hansen, Jeff K, Palmer, Brad G, Singh, Brij N, Kinyanjui, Robert K, Zurn, Michael J, Roan, Thomas J
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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