ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY
An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead fra...
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| creator | Hansen, Jeff K Palmer, Brad G Singh, Brij N Kinyanjui, Robert K Zurn, Michael J Roan, Thomas J |
| description | An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2019208659A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2019208659A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2019208659A13</originalsourceid><addsrcrecordid>eNrjZDBx9XF1Dgny9_N0VnAMDnb1dfKJVAj3DPFQcPXzcPRzdnVR8PB091AI8A93DVJwcfUL9gyJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGlkYGFmamlo6GxsSpAgBpayhq</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY</title><source>esp@cenet</source><creator>Hansen, Jeff K ; Palmer, Brad G ; Singh, Brij N ; Kinyanjui, Robert K ; Zurn, Michael J ; Roan, Thomas J</creator><creatorcontrib>Hansen, Jeff K ; Palmer, Brad G ; Singh, Brij N ; Kinyanjui, Robert K ; Zurn, Michael J ; Roan, Thomas J</creatorcontrib><description>An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.</description><language>eng</language><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONTROL OR REGULATION THEREOF ; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190704&DB=EPODOC&CC=US&NR=2019208659A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190704&DB=EPODOC&CC=US&NR=2019208659A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hansen, Jeff K</creatorcontrib><creatorcontrib>Palmer, Brad G</creatorcontrib><creatorcontrib>Singh, Brij N</creatorcontrib><creatorcontrib>Kinyanjui, Robert K</creatorcontrib><creatorcontrib>Zurn, Michael J</creatorcontrib><creatorcontrib>Roan, Thomas J</creatorcontrib><title>ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY</title><description>An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.</description><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONTROL OR REGULATION THEREOF</subject><subject>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx9XF1Dgny9_N0VnAMDnb1dfKJVAj3DPFQcPXzcPRzdnVR8PB091AI8A93DVJwcfUL9gyJ5GFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGlkYGFmamlo6GxsSpAgBpayhq</recordid><startdate>20190704</startdate><enddate>20190704</enddate><creator>Hansen, Jeff K</creator><creator>Palmer, Brad G</creator><creator>Singh, Brij N</creator><creator>Kinyanjui, Robert K</creator><creator>Zurn, Michael J</creator><creator>Roan, Thomas J</creator><scope>EVB</scope></search><sort><creationdate>20190704</creationdate><title>ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY</title><author>Hansen, Jeff K ; Palmer, Brad G ; Singh, Brij N ; Kinyanjui, Robert K ; Zurn, Michael J ; Roan, Thomas J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2019208659A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONTROL OR REGULATION THEREOF</topic><topic>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Hansen, Jeff K</creatorcontrib><creatorcontrib>Palmer, Brad G</creatorcontrib><creatorcontrib>Singh, Brij N</creatorcontrib><creatorcontrib>Kinyanjui, Robert K</creatorcontrib><creatorcontrib>Zurn, Michael J</creatorcontrib><creatorcontrib>Roan, Thomas J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hansen, Jeff K</au><au>Palmer, Brad G</au><au>Singh, Brij N</au><au>Kinyanjui, Robert K</au><au>Zurn, Michael J</au><au>Roan, Thomas J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY</title><date>2019-07-04</date><risdate>2019</risdate><abstract>An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | ELECTRONIC ASSEMBLY WITH ENHANCED HIGH POWER DENSITY |
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