SEMICONDUCTOR DEVICES WITH REGROWN CONTACTS AND METHODS OF FABRICATION

An embodiment of a semiconductor device includes a semiconductor substrate that includes a channel, a first dielectric layer disposed over the semiconductor substrate, and a regrown contact formed through a first opening in the first dielectric layer. The regrown contact includes a regrown region fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Huang, Jenn Hwa, Yue, Yuanzheng
Format: Patent
Sprache:eng
Schlagworte:
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