MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME
Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The examp...
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| creator | How, You Chye Marcelino, Franklin Santos Tay, Huay Yann |
| description | Multi-die integrated circuit packages and methods of manufacturing the same are disclosed. An example integrated circuit package includes a first leadframe, a first die on a first side of the first leadframe, and a second die on a second side of the first leadframe opposite the first side. The example integrated circuit package further includes external second leadframe separate from the first leadframe. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME |
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