METHOD FOR WAFER TRIMMING

The invention aims for a wafer edge trimming method 1 adhered on a support wafer 2 by way of an interface layer 3. A zone at the perimeter 12 of the wafer 1 is trimmed by grinding. The stopping of the grinding is advantageously done at the level of the interface layer 3. To do this, an interface lay...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Morales, Christophe, Fournel, Franck, Zussy, Marc
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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