Semiconductor Package with Air Cavity

Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Abdul Wahid, Junny, Bakar, Roslie Saini bin, Chiang, Chau Fatt, Schmalzl, Stefan, Tuazon Bernardez, April Coleen, Othman, Nurfarena, Lee, Chee Hong, Chong, Hock Heng, Pok, Pei Luan, Kuek, Hsieh Ting, Liew, Soon Lee, Reiss, Werner, Chua, Kok Yau, Chin, Kon Hoe
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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