Semiconductor Package with Air Cavity

Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to t...

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Bibliographische Detailangaben
Hauptverfasser:	Abdul Wahid, Junny, Bakar, Roslie Saini bin, Chiang, Chau Fatt, Schmalzl, Stefan, Tuazon Bernardez, April Coleen, Othman, Nurfarena, Lee, Chee Hong, Chong, Hock Heng, Pok, Pei Luan, Kuek, Hsieh Ting, Liew, Soon Lee, Reiss, Werner, Chua, Kok Yau, Chin, Kon Hoe
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.