SECURING A SECOND OBJECT TO A FIRST OBJECT

A method of anchoring a connector in a first object includes providing the connector, the connector having a liquefiable material that is liquefiable by mechanical vibration, such as a thermoplastic material, bringing the connector into contact with low density layer that has an arrangement of discr...

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Bibliographische Detailangaben
Hauptverfasser:	Kvist, Joakim, Poschner, Patricia, Mooser, Patrick
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method of anchoring a connector in a first object includes providing the connector, the connector having a liquefiable material that is liquefiable by mechanical vibration, such as a thermoplastic material, bringing the connector into contact with low density layer that has an arrangement of discrete elements and gas-filled (empty) spaces between the discrete elements, pressing the connector against the low density layer and coupling mechanical vibration energy into the connector to cause the connector to penetrate into the low density layer to deform the discrete elements, until a flow portion of the liquefiable material becomes flowable and is caused to interpenetrate spaces between the deformed discrete elements so that an intertwined structure of the liquefiable material and the deformed discrete elements results, and stopping the mechanical vibration energy and causing the flow portion to re-solidify to anchor the connector in the low density layer.