LIQUID COOLED CHASSIS

LIQUID COOLED CHASSIS

An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating...

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Hauptverfasser: COXE, WILLIAM K, MOSS, DAVID L
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator COXE, WILLIAM K
MOSS, DAVID L
description An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title LIQUID COOLED CHASSIS
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