INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

An interconnect structure includes a damascene structure, an inter-metal dielectric (IMD), a dielectric block and a metal via. The inter-metal dielectric layer is over the damascene structure. The dielectric block is embedded in the IMD layer and has a different etch selectivity than the IMD layer....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIANG, Ming-Shuoh, SHYU, Chen-Yu, CHENG, Jye-Yen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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