STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RESISTOR

An integrated circuit has a substrate including semiconductor material and a resistor in an interconnect region, above a first level of interconnect lines. The integrated circuit further includes an electrically isolated thermal conduit having one or more interconnect lines in every interconnect lev...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Venugopal, Archana, Kande, Dhishan
Format: Patent
Sprache:eng
Schlagworte:
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