FAN-OUT SEMICONDUCTOR PACKAGE MODULE

A fan-out semiconductor package module includes a core member having first and second through-holes. A semiconductor chip is in the first through-hole and has an active surface with a connection pad and an inactive surface opposing the active surface. Another passive component is in the second throu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, Eun Sil, MYUNG, Jun Woo, KIM, Yeong A, KO, Young Gwan, KIM, Jin Su, KUROYANAGI, Akihisa
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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